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Proceedings Paper

Thermopile linear array for spectroscopy applications
Author(s): A. Levin; W. Baer; S. Harrigan; J. Zewicke; R. S. Toth
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Paper Abstract

An uncooled linear array of 66 infrared elements has been designed, simulated, and fabricated using MEMS techniques. CMOS compatible poly-Silicon thermoelectric materials are utilized. Numerical simulations optimize the geometry and physical parameters for the thermopile materials. The pixel dimensions are 2.0 mm x 0.45 mm with 0.5 mm pitch. Excellent performance has been obtained in Nitrogen environment: D* = 1.2 x 108 cm √Hz/W; ι = 31 ms; and cross talk of <15%. Measured performance is comparable to, and in some respects exceeds, the performance of thermopile linear arrays based on Bi and Sb materials. The arrays are packaged for integration with an existing dispersive infrared spectrometer.

Paper Details

Date Published: 27 April 2010
PDF: 8 pages
Proc. SPIE 7680, Next-Generation Spectroscopic Technologies III, 76800J (27 April 2010); doi: 10.1117/12.850308
Show Author Affiliations
A. Levin, Dexter Research Ctr., Inc. (United States)
W. Baer, Dexter Research Ctr., Inc. (United States)
S. Harrigan, Dexter Research Ctr., Inc. (United States)
J. Zewicke, Dexter Research Ctr., Inc. (United States)
R. S. Toth, Dexter Research Ctr., Inc. (United States)

Published in SPIE Proceedings Vol. 7680:
Next-Generation Spectroscopic Technologies III
Mark A. Druy; Christopher D. Brown; Richard A. Crocombe, Editor(s)

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