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Proceedings Paper

Photomechanical imager FPA design for manufacturability
Author(s): M. Erdtmann; G. Simelgor; S. Radhakrishnan; L. Zhang; Y. Liu; P. Y. Emelie; J. Salerno
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Paper Abstract

Employing an optical readout architecture expands the capabilities offered by uncooled thermal imagers, such as extremely fast frame rates, dual-band imaging, and multi-megapixel resolution. It also affords the ability to incorporate multiple pixel designs on the same infrared sensor chip, which we have taken advantage of to fabricate an optical readout photomechanical imager with 12 distinct pixel designs in the sensor chip layout. Using this methodology, we were able to quickly sort the designs in terms of performance and suitability for manufacturing, and thus, in an expedient and highly cost-effective manner, determine which pixel designs have merited future consideration for full-scale prototyping. A fast frame rate MWIR photomechanical imager based on one of the best pixel designs was built and tested for high-speed imaging of small arms fire.

Paper Details

Date Published: 3 May 2010
PDF: 8 pages
Proc. SPIE 7660, Infrared Technology and Applications XXXVI, 766017 (3 May 2010); doi: 10.1117/12.850286
Show Author Affiliations
M. Erdtmann, Agiltron, Inc. (United States)
G. Simelgor, Agiltron, Inc. (United States)
S. Radhakrishnan, Agiltron, Inc. (United States)
L. Zhang, Agiltron, Inc. (United States)
Y. Liu, Agiltron, Inc. (United States)
P. Y. Emelie, Agiltron, Inc. (United States)
J. Salerno, Agiltron, Inc. (United States)

Published in SPIE Proceedings Vol. 7660:
Infrared Technology and Applications XXXVI
Bjørn F. Andresen; Gabor F. Fulop; Paul R. Norton, Editor(s)

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