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Proceedings Paper

Simplified "Litho-Cluster-Only" solution for double patterning
Author(s): H. Tanaka; K. Hoshiko; T. Shimokawa; H. F. Hoefnagels; D. E. Keller; S. Wang; O. Tanriseven; R. Maas; J. Mallman; K. Shigemori; C. Rosslee
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Paper Abstract

Double patterning is one of the enabling techniques to allow for further shrinking of devices in the future. Many different solutions, like LELE (Litho-Etch-Litho-Etch) and LPL (Litho-Process-Litho), have been investigated in the past years. In this paper a simplified - "Litho-Cluster-Only" - solution for double patterning is presented. This topcoat-less thermal freeze process has high capability of reaching 26 nm 1:1 LS. In addition it is shown that defect counts for the thermal freeze process approach defect numbers for high end immersion processes.

Paper Details

Date Published: 30 March 2010
PDF: 10 pages
Proc. SPIE 7639, Advances in Resist Materials and Processing Technology XXVII, 76391V (30 March 2010); doi: 10.1117/12.848462
Show Author Affiliations
H. Tanaka, JSR Corp. (Japan)
K. Hoshiko, JSR Corp. (Japan)
T. Shimokawa, JSR Corp. (Japan)
H. F. Hoefnagels, ASML Netherlands B.V. (Netherlands)
D. E. Keller, ASML Netherlands B.V. (Netherlands)
S. Wang, ASML Netherlands B.V. (Netherlands)
O. Tanriseven, ASML Netherlands B.V. (Netherlands)
R. Maas, ASML Netherlands B.V. (Netherlands)
J. Mallman, ASML Netherlands B.V. (Netherlands)
K. Shigemori, SOKUDO Co., Ltd. (Japan)
C. Rosslee, SOKUDO Co., Ltd. (Japan)

Published in SPIE Proceedings Vol. 7639:
Advances in Resist Materials and Processing Technology XXVII
Robert D. Allen, Editor(s)

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