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Proceedings Paper

Line-edge roughness and the ultimate limits of lithography
Author(s): Chris A. Mack
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Paper Abstract

In this paper, a stochastic modeling approach is used to predict the results of the exposure and post-exposure bake of a chemically amplified photoresist. The statistics of photon shot noise, chemical concentration, exposure, reaction-diffusion, and amplification are derived. The result, though preliminary, is a prediction of the standard deviation of the final deprotection level of polymer molecules in the resist using simple, analytical expressions. Combining this result with ongoing work to characterize the stochastics of resist development will eventually lead to a full model of the line-edge roughness of a resist feature. The current model is used to elucidate the impact of acid diffusion on line-edge roughness.

Paper Details

Date Published: 25 March 2010
PDF: 16 pages
Proc. SPIE 7639, Advances in Resist Materials and Processing Technology XXVII, 763931 (25 March 2010); doi: 10.1117/12.848236
Show Author Affiliations
Chris A. Mack, (United States)

Published in SPIE Proceedings Vol. 7639:
Advances in Resist Materials and Processing Technology XXVII
Robert D. Allen, Editor(s)

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