Share Email Print

Proceedings Paper

Image quality and wafer level optics
Author(s): Y. Dagan; G. Humpston
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

Increasing demand from consumers to integrate camera modules into electronic devices, such as cell phones, has driven the cost of camera modules down very rapidly. Now that most cell phones include at least one camera, consumers are starting to ask for better image quality - without compromising on the cost. Wafer level optics has emerged over the past few years as an innovative technology enabling simultaneous manufacturing of thousands of lenses, at the wafer level. Using reflow-compatible materials to manufacture these lenses permits a reduction in the cost and size of camera module, thus answering the market demand for lowering the cost. But what about image quality? The author will present image quality analysis that was conducted for both VGA and megapixel camera resolutions. Comparison between conventional camera modules and wafer level camera modules shows wafer level technology brings equivalent, if not better, image quality performance compared to conventional camera modules.

Paper Details

Date Published: 5 May 2010
PDF: 10 pages
Proc. SPIE 7723, Optics, Photonics, and Digital Technologies for Multimedia Applications, 772315 (5 May 2010); doi: 10.1117/12.847068
Show Author Affiliations
Y. Dagan, Tessera, Inc. (United States)
G. Humpston, Tessera, Inc. (United States)

Published in SPIE Proceedings Vol. 7723:
Optics, Photonics, and Digital Technologies for Multimedia Applications
Peter Schelkens; Touradj Ebrahimi; Gabriel Cristóbal; Frédéric Truchetet; Pasi Saarikko, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?