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Proceedings Paper

Improving CD uniformity for thermal cured systems in double patterning
Author(s): Lori Joesten; Ken Spizuoco; Yi Liu; Young Bae
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Paper Abstract

The implementation of double patterning processes in 193 immersion lithography is moving forward. The industry is examining several methods of producing robust double pattern images. These methods include thermal cure resists and the use of a spin on chemical to cure the layer 1 resist image. Thermal cure resist systems require fewer processing steps than a chemical curing process. An effective thermal cure process improves process throughput, reduces chemical costs and reduces process complexity In either case, producing wafers with adequate CD Uniformity (CDU) relies on the ability of the layer 1 resist to remain inert during subsequent processing steps. The goal of this paper is to isolate and optimize the critical processing steps using thermal cured resists in order to improve CDU. The system includes a layer 1 thermal cured resist and a traditional layer 2 resist. Processing was done using a TEL Lithius I+ and an ASML XT Twinscan 1900i. The feature of interest is a 42 nm x-Hatch contact hole produced by horizontal lines exposed with layer 1 and vertical lines exposed with layer 2.

Paper Details

Date Published: 30 March 2010
PDF: 12 pages
Proc. SPIE 7639, Advances in Resist Materials and Processing Technology XXVII, 76391X (30 March 2010); doi: 10.1117/12.846602
Show Author Affiliations
Lori Joesten, Dow Electronic Materials (United States)
Ken Spizuoco, Dow Electronic Materials (United States)
Yi Liu, Dow Electronic Materials (United States)
Young Bae, Dow Electronic Materials (United States)

Published in SPIE Proceedings Vol. 7639:
Advances in Resist Materials and Processing Technology XXVII
Robert D. Allen, Editor(s)

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