
Proceedings Paper
Deposition of polymer barrier materials by resonant infrared pulsed laser ablationFormat | Member Price | Non-Member Price |
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Paper Abstract
We describe resonant infrared pulsed laser deposition (RIR-PLD) of cyclic olefin copolymer, a barrier and protective
layer; for comparison, we describe RIR-PLD of polystyrene and poly(ethylene dioxythiophene) about which we already
have significant knowledge. Film deposition based on resonant infrared laser ablation is a low-temperature process leading
to evaporation and deposition of intact molecules. In this paper, we focus on deposition of this model barrier and
protective material that is potentially useful in the fabrication of organic light emitting diodes. The films were characterized
by scanning electron microscopy and Fourier-transform infrared spectroscopy. We also compared the properties of
films deposited by a free electron laser and a picosecond optical parametric oscillator.
Paper Details
Date Published: 23 February 2010
PDF: 11 pages
Proc. SPIE 7585, Laser-based Micro- and Nanopackaging and Assembly IV, 758507 (23 February 2010); doi: 10.1117/12.846417
Published in SPIE Proceedings Vol. 7585:
Laser-based Micro- and Nanopackaging and Assembly IV
Wilhelm Pfleging; Yongfeng Lu; Kunihiko Washio; Jun Amako; Willem Hoving, Editor(s)
PDF: 11 pages
Proc. SPIE 7585, Laser-based Micro- and Nanopackaging and Assembly IV, 758507 (23 February 2010); doi: 10.1117/12.846417
Show Author Affiliations
S. M. Avanesyan, Vanderbilt Univ. (United States)
A. Halabica, Vanderbilt Univ. (United States)
S. L. Johnson, Vanderbilt Univ. (United States)
M. J. Kelley, College of William and Mary (United States)
Thomas Jefferson National Accelerator Facility (United States)
J. M. Klopf, Thomas Jefferson National Accelerator Facility (United States)
A. Halabica, Vanderbilt Univ. (United States)
S. L. Johnson, Vanderbilt Univ. (United States)
M. J. Kelley, College of William and Mary (United States)
Thomas Jefferson National Accelerator Facility (United States)
J. M. Klopf, Thomas Jefferson National Accelerator Facility (United States)
H. K. Park, AppliFlex LLC (United States)
K. E. Schriver, Vanderbilt Univ. (United States)
S. Singaravelu, Thomas Jefferson National Accelerator Facility (United States)
Old Dominion Univ. (United States)
R. F. Haglund Jr., Vanderbilt Univ. (United States)
K. E. Schriver, Vanderbilt Univ. (United States)
S. Singaravelu, Thomas Jefferson National Accelerator Facility (United States)
Old Dominion Univ. (United States)
R. F. Haglund Jr., Vanderbilt Univ. (United States)
Published in SPIE Proceedings Vol. 7585:
Laser-based Micro- and Nanopackaging and Assembly IV
Wilhelm Pfleging; Yongfeng Lu; Kunihiko Washio; Jun Amako; Willem Hoving, Editor(s)
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