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Proceedings Paper

Carbon-rich spin on sidewall material for self-aligned double-patterning technology
Author(s): Dennis Shu-Hao Hsu; Hiroaki Yaguchi; Rikimaru Sakamoto; Daisuke Maruyama; Yasushi Sakaida; Walter Wang; Chun-Yen Huang; Wen-Bin Wu; Bang-Ching Ho; Chiang-Lin Shih
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Paper Abstract

Double exposure (DE) and double patterning (DP) have emerged as leading candidates to fill the technology gap between water immersion and EUV lithography. Various approaches of them are proposed to achieve 3x-nm half-pitch dense lines and beyond. Both DE with two resist processes and double patterning (DP) require two separate exposures, and they are faced very tight overlay margin by the scanner tool. By contrast, self-aligned double patterning (SADP) requires one exposure only, and provides high feasibility for 3x-nm node at this moment. However, a sequential order of multiple non-lithographic steps (film deposition, etch, and CMP) cause a complicated and expensive process of SADP. Instead of using complicated sacrificial layers, the spacers are directly formed at the sidewall of the resist patterns by low-temperature CVD deposition or spin on sidewall (SoS) material coating. In this paper, lower cost-of-ownership of SoS material are studied for SADP process.

Paper Details

Date Published: 25 March 2010
PDF: 7 pages
Proc. SPIE 7639, Advances in Resist Materials and Processing Technology XXVII, 763908 (25 March 2010); doi: 10.1117/12.846267
Show Author Affiliations
Dennis Shu-Hao Hsu, Nanya Technology Corp. (Taiwan)
Hiroaki Yaguchi, Nissan Chemical Industries, Ltd. (Japan)
Rikimaru Sakamoto, Nissan Chemical Industries, Ltd. (Japan)
Daisuke Maruyama, Nissan Chemical Industries, Ltd. (Japan)
Yasushi Sakaida, Nissan Chemical Industries, Ltd. (Japan)
Walter Wang, Nanya Technology Corp. (Taiwan)
Chun-Yen Huang, Nanya Technology Corp. (Taiwan)
Wen-Bin Wu, Nanya Technology Corp. (Taiwan)
Bang-Ching Ho, Nissan Chemical Industries, Ltd. (Japan)
Chiang-Lin Shih, Nanya Technology Corp. (Taiwan)

Published in SPIE Proceedings Vol. 7639:
Advances in Resist Materials and Processing Technology XXVII
Robert D. Allen, Editor(s)

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