Share Email Print

Proceedings Paper

Challenges and opportunities of manufacturing the next generation of integrated photonics
Author(s): R. Singh; N. Gupta; J. A. Sadie; K. F. Poole; J. Ballato; S. J. Hwu
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

Integrated photonics has the potential of fabricating a diverse set of photonic systems on a single substrate. At nanoscales (< 100 nm), the properties of material depend on quantum confinements. The challenge is to integrate these unique properties of nanostructures into low-cost manufacturing. For material deposition, a photo-assisted monolayer deposition technique can provide nanomaterials with an ultra-low defect density. Epitaxial dielectrics offer the possibility of growing defect-free optical materials including compound semiconductors on silicon substrates. In this paper, we have also provided manufacturing directions that must be incorporated for developing the next generation of integrated photonics.

Paper Details

Date Published: 19 February 2010
PDF: 8 pages
Proc. SPIE 7591, Advanced Fabrication Technologies for Micro/Nano Optics and Photonics III, 75910N (19 February 2010); doi: 10.1117/12.845954
Show Author Affiliations
R. Singh, Clemson Univ. (United States)
N. Gupta, Clemson Univ. (United States)
J. A. Sadie, Clemson Univ. (United States)
K. F. Poole, Clemson Univ. (United States)
J. Ballato, Clemson Univ. (United States)
S. J. Hwu, Clemson Univ. (United States)

Published in SPIE Proceedings Vol. 7591:
Advanced Fabrication Technologies for Micro/Nano Optics and Photonics III
Winston V. Schoenfeld; Jian Jim Wang; Marko Loncar; Thomas J. Suleski, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?