
Proceedings Paper
Up-conversion of crystal oscillator frequency in silicon package by near infrared, ultrashort laserFormat | Member Price | Non-Member Price |
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Paper Abstract
Using an ultrashort pulse laser, photon energy of which is smaller than the band gap energy of silicon, machining of
substances located at back of a silicon plate should be achievable. To realize this possibility, machining of a silicon
substrate as well as machining of gold film on it was carried out using femtosecond laser pulses, wavelength of which
lay between 1.5 to 2.5 μm. It is demonstrated that the rare surface of the silicon substrate and the gold film placed at the
back of the silicon substrate can be machined with no detectable change on its front surface. Frequency adjustment of
crystal oscillator sealed in a silicon package is tried and up-conversion of the frequency is achieved by removing small
amount of thin gold film on the crystal with irradiation of 1.5 μm laser pulses through the silicon lid.
Paper Details
Date Published: 17 February 2010
PDF: 9 pages
Proc. SPIE 7584, Laser Applications in Microelectronic and Optoelectronic Manufacturing XV, 75840M (17 February 2010); doi: 10.1117/12.845475
Published in SPIE Proceedings Vol. 7584:
Laser Applications in Microelectronic and Optoelectronic Manufacturing XV
Hiroyuki Niino; Michel Meunier; Bo Gu; Guido Hennig; Jan J. Dubowski, Editor(s)
PDF: 9 pages
Proc. SPIE 7584, Laser Applications in Microelectronic and Optoelectronic Manufacturing XV, 75840M (17 February 2010); doi: 10.1117/12.845475
Show Author Affiliations
Yoshiro Ito, Nagaoka Univ. of Technology (Japan)
Fumiya Sato, Nagaoka Univ. of Technology (Japan)
Yuuki Shinohe, Nagaoka Univ. of Technology (Japan)
Fumiya Sato, Nagaoka Univ. of Technology (Japan)
Yuuki Shinohe, Nagaoka Univ. of Technology (Japan)
Published in SPIE Proceedings Vol. 7584:
Laser Applications in Microelectronic and Optoelectronic Manufacturing XV
Hiroyuki Niino; Michel Meunier; Bo Gu; Guido Hennig; Jan J. Dubowski, Editor(s)
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