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Proceedings Paper

Chip-scale photonic interconnects for reconfigurable computing
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Paper Abstract

We present and discuss several of the benefits associated with using chip-scale optical interconnects in reconfigurable computing systems. As is well known, by removing metallic traces in high-speed systems, many signal integrity issues are reduced, or eliminated, e.g., parasitic capacitance and inductance associated self-induced affects and trace overlay. In addition, photonic systems can require less power and offer higher efficiency, thereby, giving rise to reduced thermal energy dissipation. However, at least in the case of reconfigurable processors there are several additional advantages. A case in point is that of field programmable gate arrays (FPGAs), which is a technology that has been plagued by interconnect limitations. To address this, we have developed an interconnect network that will enable fully reconfigurable processors, or FPGAs. Our approach is based on a photonic crystal cross-bar switch that enables complete interconnectivity over large computational-block arrays. Perhaps one of the most attractive benefits of our approach is that it alleviates the need to perform place and route during processor layout. As such, our approach may allow for reconfigurable processors consisting of a higher density of computing-blocks along with a faster interconnect medium. Accordingly, this talk will present numerical studies, design and fabrication of various implementations of candidate photonic crystal devices for reconfigurable optically interconnected chip-scale networks.

Paper Details

Date Published: 24 February 2010
PDF: 8 pages
Proc. SPIE 7609, Photonic and Phononic Crystal Materials and Devices X, 76090O (24 February 2010); doi: 10.1117/12.842468
Show Author Affiliations
Ahmed Sharkawy, EM Photonics, Inc. (United States)
Ozgenc Ebil, EM Photonics, Inc. (United States)
Mathew Zablocki, Univ. of Delaware (United States)
Shouyuan Shi, Univ. of Delaware (United States)
Dennis W. Prather, Univ. of Delaware (United States)

Published in SPIE Proceedings Vol. 7609:
Photonic and Phononic Crystal Materials and Devices X
Ali Adibi; Shawn-Yu Lin; Axel Scherer, Editor(s)

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