This paper describes hybrid assembly of a wavelength selective switch using laser-formed glass bumps. Recently, a process was developed for forming raised bumps on IR-absorbing glass substrates using a focused laser beam. Glass bumps with heights exceeding 90 μm have been formed with an accuracy of ~100 nm using multiple laser shots. Proper selection of materials permits the bump height to be raised or lowered via subsequent laser shots by adjusting laser power. Processes are described for precision alignment of planar AWG components to a pedestal-mounted planar SOA array by forming three glass laser bumps beneath the AWG components. While the iterative process of bump formation and component position assessment was performed manually, this work demonstrates that the process is predictable and well-suited for automation.

Date Published: 23 February 2010
PDF: 12 pages
Proc. SPIE 7607, Optoelectronic Interconnects and Component Integration IX, 760711 (23 February 2010); doi: 10.1117/12.842386

Published in SPIE Proceedings Vol. 7607:
Optoelectronic Interconnects and Component Integration IX
Alexei L. Glebov; Ray T. Chen, Editor(s)