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Proceedings Paper

Laser microstructuring of sapphire wafer and fiber
Author(s): Yutang Dai; Gang Xu; Jianlei Cui; Fan Bai
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Paper Abstract

Currently, sapphire is widely used in the field of optoelectronic devices and micro-mechanical components. One of the problems in using sapphire is the difficulty in cutting and micro-structuring due to the hardness of sapphire itself. In this paper, laser micromachining characteristics of sapphire are investigated using 157nm DUV laser micro-ablation system. Under laser fluence of 3-4 J/cm2, the maximum ablation rate could reach to 400nm/s. For 3D laser ablation, it is necessary to select a proper combination of process parameters. Several 3D micro-structures are produced in sapphire wafers and sapphire fibers. As a whole, the ablation equality is good for use.

Paper Details

Date Published: 16 February 2010
PDF: 8 pages
Proc. SPIE 7590, Micromachining and Microfabrication Process Technology XV, 75900O (16 February 2010);
Show Author Affiliations
Yutang Dai, Wuhan Univ. of Technology (China)
Gang Xu, Wuhan Univ. of Technology (China)
Jianlei Cui, Wuhan Univ. of Technology (China)
Fan Bai, Wuhan Univ. of Technology (China)

Published in SPIE Proceedings Vol. 7590:
Micromachining and Microfabrication Process Technology XV
Mary Ann Maher; Jung-Chih Chiao; Paul J. Resnick, Editor(s)

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