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Proceedings Paper

Design and characterization of MEMS interferometric sensing
Author(s): R. Snyder; A. Siahmakoun
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Paper Abstract

A MEMS-based interferometric sensor is produced using the multi-user MEMS processing standard (MUMPS) micromirrors, movable by thermal actuation. The interferometer is comprised of gold reflection surfaces, polysilicon thermal actuators, hinges, latches and thin film polarization beam splitters. A polysilicon film of 3.5 microns reflects and transmits incident polarized light from an external laser source coupled to a multi-mode optical fiber. The input beam is shaped to a diameter of 10 to 20 microns for incidence upon the 100 micron mirrors. Losses in the optical path include diffraction effects from etch holes created in the manufacturing process, surface roughness of both gold and polysilicon layers, and misalignment of micro-scale optical components. Numerous optical paths on the chip vary by length, number of reflections, and mirror subsystems employed. Subsystems include thermal actuator batteries producing lateral position displacement, angularly tunable mirrors, double reflection surfaces, and static vertical mirrors. All mirror systems are raised via manual stimulation using two micron, residue-free probe tips and some may be aligned using electrical signals causing resistive heating in thermal actuators. The characterization of thermal actuator batteries includes maximum displacement, deflection, and frequency response that coincides with theoretical thermodynamic simulations using finite-element analysis. Maximum deflection of 35 microns at 400 mW input electrical power is shown for three types of actuator batteries as is deflection dependent frequency response data for electrical input signals up to 10 kHz.

Paper Details

Date Published: 17 February 2010
PDF: 11 pages
Proc. SPIE 7594, MOEMS and Miniaturized Systems IX, 75940Z (17 February 2010); doi: 10.1117/12.841002
Show Author Affiliations
R. Snyder, Rose-Hulman Institute of Technology (United States)
A. Siahmakoun, Rose-Hulman Institute of Technology (United States)

Published in SPIE Proceedings Vol. 7594:
MOEMS and Miniaturized Systems IX
Harald Schenk; Wibool Piyawattanametha, Editor(s)

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