
Proceedings Paper
Pressure sensing in vacuum hermetic micropackaging for MOEMS-MEMSFormat | Member Price | Non-Member Price |
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Paper Abstract
Packaging constitutes one of the most costly steps of MEMS/MOEMS manufacturing. Uncooled IR bolometers require a
vacuum atmosphere below 10 mTorr to operate at their highest sensitivity. The bolometer response is also dependent on
the package temperature. In order to minimize cost, real estate and power consumption, temperature stabilization is
typically not provided to the package. Hence, long term high sensitivity operation of IR bolometric radiometers requires
a calibration as function of in package pressure and temperature. A low-cost and accurate means of measuring the
pressure in the package without being affected by the operating temperature is therefore needed.
INO has developed a low-cost, low-temperature hybrid vacuum micropackaging technology 1-3. An equivalent flow rate
of 4×10-14 Torr·L/sec for storage at 80°C has been obtained without getter. Even with such low flow, the long term
stabilization of residual pressure variations affects the sensitivity and calibration of the IR bolometers. INO has
developed MEMS pressure sensors that allow for real-time measurement of package pressure above 1 mTorr, and can be
integrated with the IR bolometers in a die-level packaging process or microfabricated simultaneously on the same die.
In this paper, the typical performance and measurement uncertainty of these pressure sensors will be presented along
with a reading method that provides a pressure measurement with a dependence on the package temperature as low as
0.7 %/°C. Complex reading circuit or temperature control of the packages are not required, making the pressure sensor
well adapted for low-cost high-volume production and integration with IR bolometer arrays.
Paper Details
Date Published: 4 February 2010
PDF: 10 pages
Proc. SPIE 7592, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX, 759204 (4 February 2010); doi: 10.1117/12.840931
Published in SPIE Proceedings Vol. 7592:
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX
Richard C. Kullberg; Rajeshuni Ramesham, Editor(s)
PDF: 10 pages
Proc. SPIE 7592, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX, 759204 (4 February 2010); doi: 10.1117/12.840931
Show Author Affiliations
Marco Michele Sisto, Institut National d'Optique (Canada)
Sonia García-Blanco, Institut National d'Optique (Canada)
Loïc Le Noc, Institut National d'Optique (Canada)
Bruno Tremblay, Institut National d'Optique (Canada)
Sonia García-Blanco, Institut National d'Optique (Canada)
Loïc Le Noc, Institut National d'Optique (Canada)
Bruno Tremblay, Institut National d'Optique (Canada)
Yan Desroches, Institut National d'Optique (Canada)
Jean-Sol Caron, Institut National d'Optique (Canada)
Francis Provencal, Institut National d'Optique (Canada)
Francis Picard, Institut National d'Optique (Canada)
Jean-Sol Caron, Institut National d'Optique (Canada)
Francis Provencal, Institut National d'Optique (Canada)
Francis Picard, Institut National d'Optique (Canada)
Published in SPIE Proceedings Vol. 7592:
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX
Richard C. Kullberg; Rajeshuni Ramesham, Editor(s)
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