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Proceedings Paper

Optical interface devices applying UV curable resin for flexible optical interconnection
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Paper Abstract

The success of optical interconnection for practical use is strongly dependent on the development of a sophisticated packaging and coupling technology capable of both high coupling efficiency and easy alignment. We have developed the photomask transfer method applying UV curable resin. This technology enables fabrication of arrayed M x N optical patterns at one shot of UV light. It is also possible to fabricate very precise patterns by a conventional photomask. The length/thickness of the fabricated patterns can be controlled by the thickness between the photomask and the substrate. The maximum length reaches over 1,000μm. As applications using this method, two original devices are reviewed. One is a chip optical device which consists of a VCSEL (vertical cavity surface emitting laser), optical rods as cores, and a surrounding clad layer. These optical rods can be accurately fabricated on the emitting spot of the VCSEL. This VCSEL device enables flexible packaging on OE-PWBs (opto-electric printed wiring boards). Another is a 90-degree light path conversion device for coupling to an optical wiring on OE-PWBs. It features in hybrid comb-clad consisting of air and polymer parts. This device has a large refractive index difference between the core and hybrid comb-clad, and enables downsizing.

Paper Details

Date Published: 23 February 2010
PDF: 10 pages
Proc. SPIE 7607, Optoelectronic Interconnects and Component Integration IX, 76070T (23 February 2010); doi: 10.1117/12.840129
Show Author Affiliations
Osamu Mikami, Tokai Univ. (Japan)
Masahiro Kanda, Tokai Univ. (Japan)

Published in SPIE Proceedings Vol. 7607:
Optoelectronic Interconnects and Component Integration IX
Alexei L. Glebov; Ray T. Chen, Editor(s)

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