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Proceedings Paper

Determining thermal and mechanical properties of polyimide using the DIC method
Author(s): Tao Hua; Huimin Xie; Bing Pan; Pengwan Chen; Qingming Zhang; Fenglei Huang
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Paper Abstract

Polyimide (PI) is widely used in the aerospace and microelectronics industry and engineering due to its excellent electric and mechanical properties; however, the high thermal expansion of the PI causes the problem on the thermal expansion mismatching. A new type of PI with P-Phenylene diamine as diamine monomer is proposed to reduce the thermal expansion. The coefficient of thermal expansion (CTE) and the Young's module of this PI films are studied in this paper using DIC method. The CTE of the new type PI films is about 21x10-6/°C, which is greatly reduced. The successful results demonstrated the feasibility of DIC method to measure the thermal and mechanical properties of films.

Paper Details

Date Published: 27 August 2009
PDF: 6 pages
Proc. SPIE 7375, ICEM 2008: International Conference on Experimental Mechanics 2008, 737552 (27 August 2009); doi: 10.1117/12.839329
Show Author Affiliations
Tao Hua, Tsinghua Univ. (China)
Huimin Xie, Tsinghua Univ. (China)
Bing Pan, Tsinghua Univ. (China)
Pengwan Chen, Beijing Institute of Technology (China)
Qingming Zhang, Beijing Institute of Technology (China)
Fenglei Huang, Beijing Institute of Technology (China)

Published in SPIE Proceedings Vol. 7375:
ICEM 2008: International Conference on Experimental Mechanics 2008
Xiaoyuan He; Huimin Xie; YiLan Kang, Editor(s)

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