
Proceedings Paper
Validation of the predictive power of a calibrated physical stochastic resist modelFormat | Member Price | Non-Member Price |
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Paper Abstract
A newly developed stochastic resist model, implemented in a prototype version of the PROLITH
lithography simulation software is fitted to experimental data for a commercially available immersion ArF
photoresist, EPIC 2013 (Dow Electronic Materials). Calibration is performed only considering the mean CD
value through focus and dose for three line/space features of varying pitch (dense, semi-dense and isolated).
An unweighted Root Mean Squared Error (RMSE) of approximately 2.0 nm is observed when the calibrated
model is compared to the experimental data. Although the model is calibrated only to mean CD values, it is
able to accurately predict LER through focus to better than 1.5 nm RMSE and highly accurate CDU
distributions at fixed focus and dose conditions. It is also shown how a stochastic model can be used to the
describe the bridging behavior often observed at marginal focus and exposure conditions.
Paper Details
Date Published: 12 December 2009
PDF: 9 pages
Proc. SPIE 7520, Lithography Asia 2009, 75201N (12 December 2009); doi: 10.1117/12.836901
Published in SPIE Proceedings Vol. 7520:
Lithography Asia 2009
Alek C. Chen; Woo-Sung Han; Burn J. Lin; Anthony Yen, Editor(s)
PDF: 9 pages
Proc. SPIE 7520, Lithography Asia 2009, 75201N (12 December 2009); doi: 10.1117/12.836901
Show Author Affiliations
Stewart A. Robertson, KLA-Tencor Corp. (United States)
John J. Biafore, KLA-Tencor Corp. (United States)
Mark D. Smith, KLA-Tencor Corp. (United States)
John J. Biafore, KLA-Tencor Corp. (United States)
Mark D. Smith, KLA-Tencor Corp. (United States)
Michael T. Reilly, Dow Electronic Materials (United States)
Jerome Wandell, Dow Electronic Materials (United States)
Jerome Wandell, Dow Electronic Materials (United States)
Published in SPIE Proceedings Vol. 7520:
Lithography Asia 2009
Alek C. Chen; Woo-Sung Han; Burn J. Lin; Anthony Yen, Editor(s)
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