Proceedings Paper
Research on CFRP materials nondestructive testing by IR lock-in thermography| Format | Member Price | Non-Member Price |
|---|---|---|
| $17.00 | $21.00 |
Paper Abstract
Lock-in thermography which is an active thermography technique for NDT is based on propagation and reflection of
thermal waves which are launched from the surface into the inspected component by absorption of modulated radiation.
Phase angle images obtained by superposition of the initial thermal wave and its internal reflection display hidden
thermal structures down to a certain depth below surface. Defects are found by comparing the observed features with
expected features provided by an intact reference sample. This technique has been widely applied to detect the defection
of many materials and structure in aerospace and automotive industry. In this study, the law of sine modulated lamp was
used for active heat source into the CFRP plate sample. The theory of thermal wave transmission and reflection were
studied deeply by finite difference method and thermal-electronic equaling model. The thermal wave image sequences
were collected with infrared camera, and the program of IR Lock-in thermography was developed by Visual C++
development platform. So that the phase image was extracted between the reflection thermal wave and reference ones on
the surface of sample by means of correlation algorithms or Fourier transform. The experimental results show that the
simulation is closed to the experimental ones. The defect character is detected clearly, and the relation between phase
and defect depth is obtained by lock-in thermography, this relation can be used to measure the defect depth. Lock-in
thermography is an effective tool to detect the Debonding defect of CFRP materials.
Paper Details
Date Published: 5 August 2009
PDF: 9 pages
Proc. SPIE 7383, International Symposium on Photoelectronic Detection and Imaging 2009: Advances in Infrared Imaging and Applications, 73833U (5 August 2009); doi: 10.1117/12.835295
Published in SPIE Proceedings Vol. 7383:
International Symposium on Photoelectronic Detection and Imaging 2009: Advances in Infrared Imaging and Applications
Jeffery Puschell; Hai-mei Gong; Yi Cai; Jin Lu; Jin-dong Fei, Editor(s)
PDF: 9 pages
Proc. SPIE 7383, International Symposium on Photoelectronic Detection and Imaging 2009: Advances in Infrared Imaging and Applications, 73833U (5 August 2009); doi: 10.1117/12.835295
Show Author Affiliations
Hui Liu, Harbin Institute of Technology (China)
Yinhang He, Harbin Institute of Technology (China)
Yinhang He, Harbin Institute of Technology (China)
Published in SPIE Proceedings Vol. 7383:
International Symposium on Photoelectronic Detection and Imaging 2009: Advances in Infrared Imaging and Applications
Jeffery Puschell; Hai-mei Gong; Yi Cai; Jin Lu; Jin-dong Fei, Editor(s)
© SPIE. Terms of Use
