In this paper, the effects of stress on the adhesive behavior of photoresist are described. The sources of internal stress of photoresist could be the shrinkage of photoresist during curing process and the shrinkage difference between the photoresist and the substrate. Due to high exothermicity of resin curing process, the temperature of photoresist is not uniform, which causes shrinkage difference in photoresist. Further more, when the substrate cools down, the difference of thermal expansion coefficients between the substrate and the photoresist would cause more stress. A digital phase-shifting interferometer is used to measure the curvature of substrate and then Stoney´s Formula is adopted to calculate stress. Then, a 2-D model is used to simulate temperature distribution, photoresist deformation and stress. Our results show that there is huge stress at the interface between photoresist and substrate and the stress can be reduced by anneal.

Date Published: 18 May 2009
PDF: 7 pages
Proc. SPIE 7284, 4th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Design, Manufacturing, and Testing of Micro- and Nano-Optical Devices and Systems, 72840F (18 May 2009); doi: 10.1117/12.832073

Published in SPIE Proceedings Vol. 7284:
4th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Design, Manufacturing, and Testing of Micro- and Nano-Optical Devices and Systems
Sen Han; Masaomi Kameyama; Xiangang Luo, Editor(s)