The paper presents the optical, mechanical, and electro-optical design of an interferometric inspection system for massive parallel inspection of MicroElectroMechanicalSystems (MEMS) and MicroOptoElectroMechanicalSystems (MOEMS). The basic idea is to adapt a micro-optical probing wafer to the M(O)EMS wafer under test. The probing wafer is exchangeable and contains a micro-optical interferometer array. A low coherent and a laser interferometer array are developed. Two preliminary interferometer designs are presented; a low coherent interferometer array based on a Mirau configuration and a laser interferometer array based on a Twyman-Green configuration. The optical design focuses on the illumination and imaging concept for the interferometer array. The mechanical design concentrates on the scanning system and the integration in a standard test station for micro-fabrication. Models of single channel low coherence and laser interferometers and preliminary measurement results are presented. The smart-pixel approach for massive parallel electro-optical detection and data reduction is discussed.

Date Published: 17 June 2009
PDF: 12 pages
Proc. SPIE 7389, Optical Measurement Systems for Industrial Inspection VI, 73891J (17 June 2009); doi: 10.1117/12.828162

Published in SPIE Proceedings Vol. 7389:
Optical Measurement Systems for Industrial Inspection VI
Peter H. Lehmann, Editor(s)