Share Email Print
cover

Proceedings Paper

Optical and thermal modeling of ultraviolet-LED array packaging for curing application
Author(s): Hai Liu; Zirong Tang; Tielin Shi; Guanglan Liao; Lei Nie
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

High power Ultraviolet Light-Emitting Diode (UV-LED) is currently in high demand for a variety of applications including lighting, printing, and polymer curing, with its' advantages of durability, reliability, non-hazardous and safety. Recently, the technology of Semiconductor Light Matrix (SLM) by multiple individual LEDs mounted on panels was put forward to obtain higher power for curing application. However, the illumination uniformity of high power LED arrays still remains an issue. On the other hand, it has been also predicted previously that the lifetime of a device decays exponentially as the temperature increases. Therefore, the thermal management of high power LEDs is also a critical factor to the development of high-power UV-LED array light source. This paper presents our latest investigations of illumination uniformity and thermal management to satisfy the requirements of packaging UV-LED arrays for curing application.

Paper Details

Date Published: 19 February 2009
PDF: 7 pages
Proc. SPIE 7279, Photonics and Optoelectronics Meetings (POEM) 2008: Optoelectronic Devices and Integration, 72791K (19 February 2009); doi: 10.1117/12.823275
Show Author Affiliations
Hai Liu, Huazhong Univ. of Science and Technology (China)
Zirong Tang, Huazhong Univ. of Science and Technology (China)
Tielin Shi, Huazhong Univ. of Science and Technology (China)
Guanglan Liao, Huazhong Univ. of Science and Technology (China)
Lei Nie, Huazhong Univ. of Science and Technology (China)


Published in SPIE Proceedings Vol. 7279:
Photonics and Optoelectronics Meetings (POEM) 2008: Optoelectronic Devices and Integration
Liming Zhang; Michael J. O'Mahony, Editor(s)

© SPIE. Terms of Use
Back to Top