Share Email Print

Proceedings Paper

Single crystalline silicon-based surface micromachining for high-precision inertial sensors: technology and design for reliability
Author(s): Roy Knechtel
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

In this paper, a foundry process for surface micromachined inertial sensors such as accelerometers or gyroscopes is introduced, with special attention on reliability aspects. Reliability was a major focus during the development phase, leading to the choice of the single crystalline silicon layer of an SOI device wafer as the mechanically active material. Glass frit wafer bonding is used for capping and hermetic sealing, but in addition to these fundamental reliability aspects, many influences on reliability must be considered, such as the risk of sticking, local stress concentration, electrical effects or the defined limitations of the mechanical movement in the interaction of design and technology. Reliability test results, as well as measures for improving the reliability and performance, are discussed in this paper.

Paper Details

Date Published: 18 May 2009
PDF: 9 pages
Proc. SPIE 7362, Smart Sensors, Actuators, and MEMS IV, 73620O (18 May 2009); doi: 10.1117/12.821643
Show Author Affiliations
Roy Knechtel, X-FAB Semiconductor Foundries AG (Germany)

Published in SPIE Proceedings Vol. 7362:
Smart Sensors, Actuators, and MEMS IV
Ulrich Schmid, Editor(s)

© SPIE. Terms of Use
Back to Top