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Proceedings Paper

Optical method for testing of the packaging reliability of IC chips
Author(s): Xianming Xiong; Li Huang; Yanxiong Lin
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Paper Abstract

This paper describes a very simple and reliable procedure for testing packaging reliability of integrated circuits (IC) chips with a single optical experimental set-up. The procedure is based on the principle that it is possible to test minuteness displacement and thermal deformation with electronic speckle pattern interferometer (ESPI) techniques. The chips' direct performance of packaging reliability is their heat reliability. Therefore, heat reliability is firstly tested and then their packaging reliability is speculated. Two similar kinds of chips are chosen as specimens. In the experiment, the speckle pictures of specimens with five groups of equivalent input heat are obtained respectively, and meanwhile their corresponding surface temperature is measured. Disposing pattern stripes and calculating the heat source temperature show that both their off-surface displacement deformation and temperature are obviously different. From the experimental data, the simulation curve of off-surface displacement with temperature is plotted. Analyzing the changes of fitting curve testify that the chip with lower rate is of high reliability. The results justify that using ESPI could simply test packaging reliability of chips. This fact along with the exact knowledge of thermal deformation may be more useful for understanding heat stress. Moreover, this approach is characterized by fastness, reliability and real-time, and is therefore a quite effective tool for reliability analysis of microelectronic devices.

Paper Details

Date Published: 31 December 2008
PDF: 6 pages
Proc. SPIE 7130, Fourth International Symposium on Precision Mechanical Measurements, 71304D (31 December 2008); doi: 10.1117/12.819717
Show Author Affiliations
Xianming Xiong, Guilin Univ. of Electronic Technology (China)
Li Huang, Guilin Univ. of Electronic Technology (China)
Yanxiong Lin, Guilin Univ. of Electronic Technology (China)

Published in SPIE Proceedings Vol. 7130:
Fourth International Symposium on Precision Mechanical Measurements
Yetai Fei; Kuang-Chao Fan; Rongsheng Lu, Editor(s)

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