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Proceedings Paper

Recent developments of digital speckle pattern interferometry for full-field strain measurement
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Paper Abstract

Digital Speckle Pattern Interferometry (DSPI), originally known as electronic speckle pattern interferometry (ESPI), is an interferometry based method that allows whole field, non-contacting measurement of microscopic deformation, and thus exact determination of strain distribution. This paper gives a review of the technique for three dimensional (3D) deformation and strain measurement with constant and variable measuring sensitivity, and presents the recent developments for absolute phase measurement. The theory and methodology for the developments are given. Experimental results are used to demonstrate potentials and limitations for material characterization.

Paper Details

Date Published: 31 December 2008
PDF: 6 pages
Proc. SPIE 7130, Fourth International Symposium on Precision Mechanical Measurements, 71302W (31 December 2008); doi: 10.1117/12.819663
Show Author Affiliations
Lianxiang Yang, Oakland Univ. (United States)
Yonghong Wang, Oakland Univ. (United States)
Hefei Univ. of Technology (China)
Dan Thomas, Oakland Univ. (United States)


Published in SPIE Proceedings Vol. 7130:
Fourth International Symposium on Precision Mechanical Measurements
Yetai Fei; Kuang-Chao Fan; Rongsheng Lu, Editor(s)

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