We report the progress in full-color 0.97-inch-diagonal SXGA and 0.57"-inch-diagonal XGA active matrix liquid crystal displays. The circuits for these displays are fabricated on 8-inch silicon-on-insulator (SOI) wafers, which are then transferred to glass wafers to produce transmissive liquid crystal displays. Significant power savings and display performance improvements have been made with innovations in display architectures and the use of indium tin oxid (ITO) pixels. The new thin efficient backlight with improved color spectrum also contributes to lower power consumption and better color gamut. The Mantech program for the SXGA display has enabled the processing of many wafers to resolve various production issues, which will result in substantially higher yield for the SXGA microdisplays.

Date Published: 6 May 2009
PDF: 8 pages
Proc. SPIE 7326, Head- and Helmet-Mounted Displays XIV: Design and Applications, 73260G (6 May 2009); doi: 10.1117/12.818882

Published in SPIE Proceedings Vol. 7326:
Head- and Helmet-Mounted Displays XIV: Design and Applications
Peter L. Marasco; Paul R. Havig; Sion A. Jennings; Thomas H. Harding, Editor(s)