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Proceedings Paper

Process transfer strategies between ASML immersion scanners
Author(s): Yuan He; Peter Engblom; Jianming Zhou; Eric Janda; Anton Devilliers; Bernd Geh; Erik Byers; Jasper Menger; Steve Hansen; Mircea Dusa
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Paper Abstract

A top challenge for Photolithographers during a process transfer involving multiple-generation scanners is tool matching. In a more general sense, the task is to ensure that the wafer printing results in the receiving fab will match or even exceed those of the originating fab. In this paper we report on two strategies that we developed to perform a photo process transfer that is tailored to the scanner's capabilities. The first strategy presented describes a method to match the CD performance of the product features on the transferred scanner. A second strategy is then presented which considers also the down-stream process tools and seeks to optimize the process for yield. Results presented include: ASML TWINSCANTM XT:1700i and XT:1900i scanners 1D printing results from a line-space test reticle, parametric sensitivity calculations for the two scanners on 1D patterns, simulation predictions for a process-optimized scanner-matching procedure, and final wafer results on 2D production patterns. Effectiveness of the optimization strategies was then concluded.

Paper Details

Date Published: 16 March 2009
PDF: 11 pages
Proc. SPIE 7274, Optical Microlithography XXII, 72742P (16 March 2009); doi: 10.1117/12.816417
Show Author Affiliations
Yuan He, Micron Technology, Inc. (United States)
Peter Engblom, ASML (United States)
Jianming Zhou, Micron Technology, Inc. (United States)
Eric Janda, ASML (United States)
Anton Devilliers, Micron Technology, Inc. (United States)
Bernd Geh, Carl Zeiss SMT AG (Germany)
Erik Byers, Micron Technology, Inc. (United States)
Jasper Menger, Carl Zeiss SMT AG (Germany)
Steve Hansen, ASML (United States)
Mircea Dusa, ASML (United States)

Published in SPIE Proceedings Vol. 7274:
Optical Microlithography XXII
Harry J. Levinson; Mircea V. Dusa, Editor(s)

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