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Proceedings Paper

Electro-mechanical coupling analysis of piezoelectric smart beams
Author(s): Jialai Wang; Shixin Zeng
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Paper Abstract

External bonding of PZT patches to host structures as sensors and actuators has emerged as a popular method in smart structural applications such as structural health monitoring and vibration and shape control. Due to the strong material mismatches between the PZT patch and host structure, severe stress concentration can be induced along the PZT-host structure interface, which can lead to interface debonding and premature failure of the smart structure. For this reason, stresses along the PZT-host structure interface are of great research interest. To find the interface stresses, existing studies commonly adopted a one-way coupling model to simulate the behavior of the piezoelectric patch, in which the electric displacement field is assumed to be uniform through the thickness of the piezoelectric patch. In this study, however, a two-way coupling model for the electrical and mechanical field interaction is proposed. The electrical displacement field in the thickness direction of the piezoelectric patch is assumed to have a parabolic distribution. Closed-form solutions of interface stresses and electric field are obtained. To verify the model and for comparison purpose, a numerical example is calculated with different models, along with the numerical solution from finite element analysis (FEA).

Paper Details

Date Published: 30 March 2009
PDF: 11 pages
Proc. SPIE 7292, Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2009, 72922U (30 March 2009); doi: 10.1117/12.815769
Show Author Affiliations
Jialai Wang, The Univ. of Alabama (United States)
Shixin Zeng, The Univ. of Alabama (United States)

Published in SPIE Proceedings Vol. 7292:
Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2009
Masayoshi Tomizuka, Editor(s)

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