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Proceedings Paper

WLCD: a new system for wafer level CD metrology on photomasks
Author(s): Sven Martin; Holger Seitz; Wolfgang Degel; Ute Buttgereit; Thomas Scherübl
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Paper Abstract

With decreasing feature size, the requirements for CD uniformity (CDU) on the wafer have become crucial for achieving the required yield in the wafer fab. This is related to tighter CDU specifications on the photomask. Currently, mask CDU is mainly measured by mask CD SEM tools. However, due to strong OPC and high MEEF mask CDU is not directly related to wafer CDU. A new Aerial Imaging based optical system has been developed by Carl Zeiss SMS which measures wafer level CD already on photomasks under scanner conditions. First results of the alpha tool show that the new tool has extremely good CD repeatability and stability. Furthermore, the effect of the scanner settings on CD uniformity is demonstrated.

Paper Details

Date Published: 23 March 2009
PDF: 9 pages
Proc. SPIE 7272, Metrology, Inspection, and Process Control for Microlithography XXIII, 72722T (23 March 2009); doi: 10.1117/12.814728
Show Author Affiliations
Sven Martin, Carl Zeiss SMS GmbH (Germany)
Holger Seitz, Carl Zeiss SMS GmbH (Germany)
Wolfgang Degel, Carl Zeiss SMS GmbH (Germany)
Ute Buttgereit, Carl Zeiss SMS GmbH (Germany)
Thomas Scherübl, Carl Zeiss SMS GmbH (Germany)

Published in SPIE Proceedings Vol. 7272:
Metrology, Inspection, and Process Control for Microlithography XXIII
John A. Allgair; Christopher J. Raymond, Editor(s)

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