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Proceedings Paper

Compensation of overlay errors due to mask bending and non-flatness for EUV masks
Author(s): Manish Chandhok; Sanjay Goyal; Steven Carson; Seh-Jin Park; Guojing Zhang; Alan M. Myers; Michael L. Leeson; Marilyn Kamna; Fabian C. Martinez; Alan R. Stivers; Gian F. Lorusso; Jan Hermans; Eric Hendrickx; Sanjay Govindjee; Gerd Brandstetter; Tod Laursen
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Paper Abstract

EUV blank non-flatness results in both out of plane distortion (OPD) and in-plane distortion (IPD) [3-5]. Even for extremely flat masks (~50 nm peak to valley (PV)), the overlay error is estimated to be greater than the allocation in the overlay budget. In addition, due to multilayer and other thin film induced stresses, EUV masks have severe bow (~1 um PV). Since there is no electrostatic chuck to flatten the mask during the e-beam write step, EUV masks are written in a bent state that can result in ~15 nm of overlay error. In this article we present the use of physically-based models of mask bending and non-flatness induced overlay errors, to compensate for pattern placement of EUV masks during the e-beam write step in a process we refer to as E-beam Writer based Overlay error Correction (EWOC). This work could result in less restrictive tolerances for the mask blank non-flatness specs which in turn would result in less blank defects.

Paper Details

Date Published: 17 March 2009
PDF: 12 pages
Proc. SPIE 7271, Alternative Lithographic Technologies, 72710G (17 March 2009); doi: 10.1117/12.814428
Show Author Affiliations
Manish Chandhok, Intel Corp. (United States)
Sanjay Goyal, Intel Corp. (United States)
Steven Carson, Intel Corp. (United States)
Seh-Jin Park, Intel Corp. (United States)
Guojing Zhang, Intel Corp. (United States)
Alan M. Myers, Intel Corp. (Belgium)
Michael L. Leeson, Intel Corp. (Belgium)
Marilyn Kamna, Intel Corp. (United States)
Fabian C. Martinez, Intel Corp. (United States)
Alan R. Stivers, Consultant (United States)
Gian F. Lorusso, IMEC (Belgium)
Jan Hermans, IMEC (Belgium)
Eric Hendrickx, IMEC (Belgium)
Sanjay Govindjee, Univ. of California, Berkeley (United States)
Gerd Brandstetter, Univ. of California, Berkeley (United States)
Tod Laursen, Duke Univ. (United States)

Published in SPIE Proceedings Vol. 7271:
Alternative Lithographic Technologies
Frank M. Schellenberg; Bruno M. La Fontaine, Editor(s)

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