
Proceedings Paper
Defectivity improvement by modified wafer edge treatment in immersion lithographyFormat | Member Price | Non-Member Price |
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Paper Abstract
ArF immersion lithography has reached mass production stage for 55-40 nm node devices. Especially, defectivity
performance at wafer edge in immersion lithography has been recently discussed in detail, because its controllability is a
key factor to obtain high yield. We have already reported that defectivity was strongly affected by the wafer edge shape
and long edge wafer showed better defectivity performance than short one. We also found remaining flakes or particles
at wafer edge after coating were easy to be peeled off on short edge wafer during exposure and these peeled flakes or
particles were most suspected candidate which induces bridging defects. Therefore it is important to prevent generating
such peeled flakes or particles for good defectivity in immersion lithography. In this paper, we will show the defectivity
results of various kinds of wafers which have different wafer edge shapes (long,short and full-round) and diameters to
investigate the effect of wafer edge geometry on defectivity performance in detail. Furthermore, we investigated the
relation of an edge removal method and the defectivity with referring bevel inspection results at each coating step. We
confirmed that the modified edge removal method well improved the defectivity performance. We will discuss them
based on the latest data and propose the most suitable technique to remove the wafer edge particles before immersion
exposure.
Paper Details
Date Published: 16 March 2009
PDF: 10 pages
Proc. SPIE 7274, Optical Microlithography XXII, 72741G (16 March 2009); doi: 10.1117/12.813385
Published in SPIE Proceedings Vol. 7274:
Optical Microlithography XXII
Harry J. Levinson; Mircea V. Dusa, Editor(s)
PDF: 10 pages
Proc. SPIE 7274, Optical Microlithography XXII, 72741G (16 March 2009); doi: 10.1117/12.813385
Show Author Affiliations
Published in SPIE Proceedings Vol. 7274:
Optical Microlithography XXII
Harry J. Levinson; Mircea V. Dusa, Editor(s)
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