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Proceedings Paper

3D-AFM booster for mass-production nanoimprint lithography
Author(s): A.-L. Foucher; J. Foucher; S. Landis
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Paper Abstract

As we are moving towards sub-32nm node, the question of lithography cost will play a key role with the introduction for example of Double Patterning. The Nanoimprint lithography is one potential candidate that could become competitive. Indeed, such technique is very promising and has already proven its ability of being potentially compatible with high volume manufacturing at low cost in order to make advanced devices. To transfer such ability in a real industrial environment, progresses have to be done to manufacture high resolution and accurate molds. To overcome this issue, fine topological characterizations of both coated mold with anti-sticking layer and imprinted materials have to be performed. Fabricated patterns have to be very well controlled in term of geometry quality, uniformity on the whole wafer. Moreover, the defectivity of the imprint process must be understood and well controlled to introduce such lithography process into the industrial environment. In this paper, we will present some experiments that have been carried out with the 3D-AFM technology on Nanoimprint molds and various imprinted wafers in order to understand more deeply either the advantages or drawbacks of this emerging lithography technique. For instance we will discuss about the anti-sticking layer which must be applied on mold before any imprint in order to keep reliable as much as possible the final industrial process. We will also present experimental results realized for both UV-NIL and Hot-Embossing NIL which are two different candidates depending on the final application. In a third part we will show and discuss some experimental results related to the Nanoimprint defectivity main drawback through the study of capillarity bridges growing.

Paper Details

Date Published: 23 March 2009
PDF: 6 pages
Proc. SPIE 7272, Metrology, Inspection, and Process Control for Microlithography XXIII, 72722J (23 March 2009); doi: 10.1117/12.811839
Show Author Affiliations
A.-L. Foucher, CEA-LETI, Minatec (France)
J. Foucher, CEA-LETI, Minatec (France)
S. Landis, CEA-LETI, Minatec (France)

Published in SPIE Proceedings Vol. 7272:
Metrology, Inspection, and Process Control for Microlithography XXIII
John A. Allgair; Christopher J. Raymond, Editor(s)

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