
Proceedings Paper
Recent advances in planar optical integrationFormat | Member Price | Non-Member Price |
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Paper Abstract
Optical technologies have changed the way people live since centuries, and the pace of knowledge creation and
implementation has strongly increased in the recent past. Prominent examples of recent change include the speed with
which information can be exchanged, allowing delay-free intercontinental communication, and the advent of the
broadband internet. The conception of planar waveguide optics has already ignited fundamental and manufacturing
research decades back, and its proclaimed uses were manifold, including data communication, bio analytics, or
illumination.
The advances in waveguide optics have also generated many approaches to integrate optical technology into packaging
technology using fabrication methods known from the semiconductor or the printed circuit board (PCB) industry. These
technologies allow planar integration of optical waveguides and support the miniaturization of integrated systems. With
the first experiments dating back to the 1970's, the performance of planar integrated optical systems has risen from
proof-of-principle to a point where it is becoming increasingly appealing for many applications to use planar integrated
optical technology. A review of the state-of-the-art in integration technologies is given and the prospectus for the use of
integrated PCB based optical links is assessed and favorable conditions for successful implementation are proposed.
Paper Details
Date Published: 12 February 2009
PDF: 10 pages
Proc. SPIE 7221, Photonics Packaging, Integration, and Interconnects IX, 722108 (12 February 2009); doi: 10.1117/12.810434
Published in SPIE Proceedings Vol. 7221:
Photonics Packaging, Integration, and Interconnects IX
Alexei L. Glebov; Ray T. Chen, Editor(s)
PDF: 10 pages
Proc. SPIE 7221, Photonics Packaging, Integration, and Interconnects IX, 722108 (12 February 2009); doi: 10.1117/12.810434
Show Author Affiliations
Markus B. K. Riester, maris TechCon Technology and R&D Consulting (Austria)
Published in SPIE Proceedings Vol. 7221:
Photonics Packaging, Integration, and Interconnects IX
Alexei L. Glebov; Ray T. Chen, Editor(s)
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