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Proceedings Paper

CTE-matched microchannel coolers
Author(s): Greg Rudd; Kalista Kusnadi; Rob Brox; Alan Grantz
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Paper Abstract

Microchannel coolers (MCC's) for laser diodes are most commonly constructed of copper or copper alloy. A disadvantage of the use of these metals is their much higher coefficient of thermal expansion (CTE) compared to GaAs. This mismatch can result in stress on the devices during soldering or operation. It can also stress the solder joint, encouraging voiding. One solution is to attach the laser to an MCC made from low CTE material. Suitable examples are tungsten-copper and molybdenum-copper. We have fabricated MCC's from these materials and have performed CFD modeling followed by flow, thermal resistance, and accelerated life tests on the parts. We show that the thermal results can be achieved that compare to copper MCC's. The erosion resistance of the materials is demonstrated to be higher than copper. Life tests using DI water flow indicates that superior life can be expected from these MCC's, especially at higher flow rates of 0.5 lpm/0.13 gpm and with lower water quality and elevated temperature. Finally, we show that the dimensional tolerances required can be obtained with these material combinations.

Paper Details

Date Published: 23 February 2009
PDF: 7 pages
Proc. SPIE 7198, High-Power Diode Laser Technology and Applications VII, 71980I (23 February 2009); doi: 10.1117/12.809747
Show Author Affiliations
Greg Rudd, Spectra-Mat, Inc. (United States)
Kalista Kusnadi, Spectra-Mat, Inc. (United States)
Rob Brox, Spectra-Mat, Inc. (United States)
Alan Grantz, Grantz Engineering (United States)

Published in SPIE Proceedings Vol. 7198:
High-Power Diode Laser Technology and Applications VII
Mark S. Zediker, Editor(s)

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