Share Email Print

Proceedings Paper

Recent advances of high voltage AlGaN/GaN power HFETs
Author(s): Yasuhiro Uemoto; Tetsuzo Ueda; Tsuyoshi Tanaka; Daisuke Ueda
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

We review our recent advances of GaN-based high voltage power transistors. These are promising owing to low on-state resistance and high breakdown voltage taking advantages of superior material properties. However, there still remain a couple of technical issues to be solved for the GaN devices to replace the existing Si-based power devices. The most critical issue is to achieve normally-off operation which is strongly desired for the safety operation, however, it has been very difficult because of the built-in polarization electric field. Our new device called GIT (Gate Injection Transistor) utilizing conductivity modulation successfully achieves the normally-off operation keeping low on-state resistance. The fabricated GIT on a Si substrate exhibits threshold voltage of +1.0V. The obtained on-state resistance and off-state breakdown voltage were 2.6mΩ•cm2 and 800V, respectively. Remaining technical issue is to further increase the breakdown voltage. So far, the reported highest off-state breakdown voltage of AlGaN/GaN HFETs has been 1900V. Overcoming these issues by a novel device structure, we have demonstrated the world highest breakdown voltages of 10400V using thick poly-crystalline AlN as a passivation film and Via-holes through sapphire which enable very efficient layout of the lateral HFET array avoiding any undesired breakdown of passivation films. Since conventional wet or dry etching cannot be used for chemically stable sapphire, high power pulsed laser is used to form the via-holes. The presented GaN power devices demonstrate that GaN is advantageous for high voltage power switching applications replacing currently used Si-based power MOSFETs and IGBTs.

Paper Details

Date Published: 16 February 2009
PDF: 11 pages
Proc. SPIE 7216, Gallium Nitride Materials and Devices IV, 721606 (16 February 2009); doi: 10.1117/12.808817
Show Author Affiliations
Yasuhiro Uemoto, Panasonic Co. Ltd. (Japan)
Tetsuzo Ueda, Panasonic Co. Ltd. (Japan)
Tsuyoshi Tanaka, Panasonic Co. Ltd. (Japan)
Daisuke Ueda, Panasonic Co. Ltd. (Japan)

Published in SPIE Proceedings Vol. 7216:
Gallium Nitride Materials and Devices IV
Hadis Morkoç; Cole W. Litton; Jen-Inn Chyi; Yasushi Nanishi; Joachim Piprek; Euijoon Yoon, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?