
Proceedings Paper
A comprehensive look at a new metrology technique to support the needs of lithography performance in near futureFormat | Member Price | Non-Member Price |
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Paper Abstract
Need for accuracy, precision, speed and sophistication in metrology has increased tremendously over the past few
years. Lithography performance will increasingly depend on post patterning metrology and this dependency will
be heavily accelerated by technology shrinkage. These requirements will soon become so stringent that the
current metrology capabilities may not be sufficient to support these near future needs. Accuracy and precision
requirements approaching well into sub-nanometer range while the demand for increase in sampling also
continues, triggering the need for a new technology in this area.
In this technical presentation the authors would like to evaluate such technology that has the potential to support
the future needs. Extensive data collection and tests are ongoing for both CD and overlay. Data on first order
diffraction based overlay shows unprecedented measurement precision. The levels of precision are so low that for
evaluation special methods has been developed and tested. In this paper overlay measurement method and data
will be discussed, as well as applicability for future nodes and novel lithography techniques. CD data will be
reported in the future technical publications.
Paper Details
Date Published: 1 December 2008
PDF: 6 pages
Proc. SPIE 7140, Lithography Asia 2008, 71400N (1 December 2008); doi: 10.1117/12.807998
Published in SPIE Proceedings Vol. 7140:
Lithography Asia 2008
Alek C. Chen; Burn Lin; Anthony Yen, Editor(s)
PDF: 6 pages
Proc. SPIE 7140, Lithography Asia 2008, 71400N (1 December 2008); doi: 10.1117/12.807998
Show Author Affiliations
Jimmy Hu, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Chih-Ming Ke, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Willie Wang, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Jacky Huang, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
H. L. Chung, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
C. R. Liang, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Victor Shih, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
H. H. Liu, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
H. J. Lee, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
L. G. Terng, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Chih-Ming Ke, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Willie Wang, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Jacky Huang, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
H. L. Chung, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
C. R. Liang, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Victor Shih, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
H. H. Liu, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
H. J. Lee, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
L. G. Terng, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Y. D. Fan, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Maurits van der Schaar, ASML (Netherlands)
Kiwi Yuan, ASML (Netherlands)
Vivien Wang, ASML (Netherlands)
Cathy Wang, ASML (Netherlands)
Mir Shahrjerdy, ASML (Netherlands)
Andreas Fuchs, ASML (Netherlands)
Kaustuve Bhattacharyya, ASML (Netherlands)
Karel van der Mast, ASML (Netherlands)
Maurits van der Schaar, ASML (Netherlands)
Kiwi Yuan, ASML (Netherlands)
Vivien Wang, ASML (Netherlands)
Cathy Wang, ASML (Netherlands)
Mir Shahrjerdy, ASML (Netherlands)
Andreas Fuchs, ASML (Netherlands)
Kaustuve Bhattacharyya, ASML (Netherlands)
Karel van der Mast, ASML (Netherlands)
Published in SPIE Proceedings Vol. 7140:
Lithography Asia 2008
Alek C. Chen; Burn Lin; Anthony Yen, Editor(s)
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