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Proceedings Paper

New 5.5 µm interline transfer CCD platform for applied imaging markets
Author(s): Douglas A. Carpenter; James A. DiBella; Robert Kaser; Stephen L. Kosman; Xueyuan Liu; John P. McCarten; Eric J. Meisenzahl; David N Nichols; Christopher Parks; Thomas R. Pian
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Paper Abstract

A new 5.5 &mgr;m pixel interline transfer CCD technology platform has been developed that offers significant improvements in performance while retaining the dynamic range, quantum efficiency, and responsivity available from the previous generation 7.4 µm pixel. Smear has been reduced to -100 dB, and a new quad-output architecture increases the maximum frame rate up to 120 fps for a 1 MPix sensor. This technology is now being deployed across a family of image sensors that share a common package and pin-out, facilitating faster camera design and product commercialization.

Paper Details

Date Published: 27 January 2009
PDF: 10 pages
Proc. SPIE 7249, Sensors, Cameras, and Systems for Industrial/Scientific Applications X, 72490C (27 January 2009); doi: 10.1117/12.806389
Show Author Affiliations
Douglas A. Carpenter, Eastman Kodak Co. (United States)
James A. DiBella, Eastman Kodak Co. (United States)
Robert Kaser, Eastman Kodak Co. (United States)
Stephen L. Kosman, Eastman Kodak Co. (United States)
Xueyuan Liu, Eastman Kodak Co. (United States)
John P. McCarten, Eastman Kodak Co. (United States)
Eric J. Meisenzahl, Eastman Kodak Co. (United States)
David N Nichols, Eastman Kodak Co. (United States)
Christopher Parks, Eastman Kodak Co. (United States)
Thomas R. Pian, Eastman Kodak Co. (United States)

Published in SPIE Proceedings Vol. 7249:
Sensors, Cameras, and Systems for Industrial/Scientific Applications X
Erik Bodegom; Valérie Nguyen, Editor(s)

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