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Proceedings Paper

Numerical simulation of all-optical wavelength conversion of DPSK signal based on SOA in a Mach-Zehnder configuration
Author(s): Wei Hong; Minghao Li; Dexiu Huang; Xinliang Zhang; Guangxi Zhu
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Paper Abstract

All-optical wavelength conversion of differential phase-shift keyed (DPSK) signals based on SOA in a Mach-Zehnder interferometer (SOA-MZI) configuration is simulated and analyzed using the transfer function of MZI and a wideband dynamic model of SOA. The operation principle is analyzed and operation point selection, influence of SOA physical parameters, different signal format and operation speed are discussed in detail. The results of 10Gb/s operation show that SOA-MZI is compatible with both non-return-to-zero (NRZ) and return-to-zero (RZ) formatted signals. However, the conversion performance is sensitive to the operation point of the involved SOAs. To maximize the Q value of the demodulated conversion signal, the power and wavelength of the original DPSK signal and the probe light should be optimized to obtain approximately π phase difference between the upper and lower arms of MZI in the middle of each bit. Besides, SOA with short carrier lifetime and large linewidth enhancement factor is preferred for wavelength conversion applications. 40Gb/s operation is also simulated with SOA carrier lifetime of 100ps, and the results strongly suggests 40Gb/s operation with RZ formatted signals and relatively large input powers of the clock signal.

Paper Details

Date Published: 18 November 2008
PDF: 11 pages
Proc. SPIE 7135, Optoelectronic Materials and Devices III, 71354D (18 November 2008); doi: 10.1117/12.804314
Show Author Affiliations
Wei Hong, Huazhong Univ. of Science and Technology (China)
Minghao Li, Huazhong Univ. of Science and Technology (China)
Dexiu Huang, Huazhong Univ. of Science and Technology (China)
Xinliang Zhang, Huazhong Univ. of Science and Technology (China)
Guangxi Zhu, Huazhong Univ. of Science and Technology (China)

Published in SPIE Proceedings Vol. 7135:
Optoelectronic Materials and Devices III
Yi Luo; Jens Buus; Fumio Koyama; Yu-Hwa Lo, Editor(s)

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