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Proceedings Paper

Investigation of UV photocurable microcapsule inner crosslink extent
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Paper Abstract

UV photocuring technology has encountered increased applications in recent years, which finds a variety of applications on protective coating of the optical-fiber, ink and optical recording materials. Combined with techniques of photohardenable, microcapsule, heat-sensitive and interface-polymerization method, a novel photoheat sensitive recording material of non-silver salt is explored in this thesis. Microcapsules are particulate substance with a core and shell structure, where photopolymerizable composition, monofunctional/polyfunctional diluents, photopolymerization initiator, photosensitivity enhancing agent and dye precursor are encapsulated as the internal phase. In this paper introduced the characteristics and curing mechanism of photo-sensitive microcapsule materials. The photocuring process may be a complex-function with photopolymerizable compound and photopolymerization initiator. For the sake of high photocuring speed and degree, optimal photo-sensitive materials were selected. In order to match with the light source excitation wavelength and absorb more wider ultraviolet band, combined type of photo-polymerization initiators were employed. With the kinds and dosage of photopolymerization initiator changing, the photocuring speed and quality can be ameliorated. Through studying the UV-visible absorption spectrum and infra-red spectrum of the material , the optical response property of the inner compound can be obtained.

Paper Details

Date Published: 18 November 2008
PDF: 8 pages
Proc. SPIE 7135, Optoelectronic Materials and Devices III, 71353Q (18 November 2008); doi: 10.1117/12.803325
Show Author Affiliations
Xiaowei Li, Hebei Univ. (China)
Shuangshuang Meng, Hebei Univ. (China)
Weidong Lai, Hebei Univ. (China)
Haiyang Yu, Hebei Univ. (China)
Guangsheng Fu, Hebei Univ. (China)

Published in SPIE Proceedings Vol. 7135:
Optoelectronic Materials and Devices III
Yi Luo; Jens Buus; Fumio Koyama; Yu-Hwa Lo, Editor(s)

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