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Proceedings Paper

Results from the KLA-Tencor TeraScanXR reticle inspection tool
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Paper Abstract

The new TeraScanXR reticle inspection system extends the capability of the previous TeraScanHR platform to advanced 32nm logic and 40nm Half Pitch (HP) memory technology nodes. The TeraScanXR has been designed to provide a significant improvement in image quality, defect sensitivity and throughput relative to the HR platform. Defect sensitivity is increased via a combination of improved Die-to-Die (D:D) and Die-to-Database (D:DB) algorithms, as well as enhancements to the image auto-focus (IAF). Modifications to system optics and the introduction of a more powerful image processing computer have enabled a ~2X faster inspection mode. In this paper, we describe the key features of the TeraScanXR platform and present preliminary data that illustrate the capability of this tool. TeraScanHR tools currently at customer sites are field-upgradeable to the TeraScanXR configuration.

Paper Details

Date Published: 17 October 2008
PDF: 9 pages
Proc. SPIE 7122, Photomask Technology 2008, 71223G (17 October 2008);
Show Author Affiliations
Aditya Dayal, KLA-Tencor Corp. (United States)
Bo Mu, KLA-Tencor Corp. (United States)
Venkat Iyer, KLA-Tencor Corp. (United States)
Phillip Lim, KLA-Tencor Corp. (United States)
Arosha Goonesekera, KLA-Tencor Corp. (United States)
Bill Broadbent, KLA-Tencor Corp. (United States)

Published in SPIE Proceedings Vol. 7122:
Photomask Technology 2008
Hiroichi Kawahira; Larry S. Zurbrick, Editor(s)

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