Share Email Print

Proceedings Paper

OPC hotspot identification challenges: ORC vs. PWQ on wafer
Author(s): Andre Poock; Sarah McGowan; Francois Weisbuch; Guido Schnasse; Rajesh Ghaskadvi
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

The identification of OPC induced litho hotspots within the product design is essential and a must to make sure that a new OPC model is working correctly and does no harm to the design and future product. Several techniques and methods for OPC verification and identification of hotspots are known and long adopted within the field. An optical rule check done by the simulation software after OPC is one way of identifying hotspots within the design of the whole chip. This is typically done by using a DRC-type width or space check on simulation contours (nominal exposure contour or process window contours). However, the pass/fail nature of this check at a single CD value requires good calibration of the simulation model to avoid false positives and ease of disposition at tapeout. Another method is the process window qualification method which uses the defect inspection of a focus exposure matrix wafer for OPC hotspot identification. However, this can not be done prior to ordering a mask. Based on a 45nm line space layer OPC qualification, we will demonstrate how optical rule check and process window qualification is performed, what the individual results will be, and how they can be used for OPC quality evaluation. The general goal of this work is to show the capabilities of optical rule check and process window qualification, compare both methods, and detect limitations.

Paper Details

Date Published: 17 October 2008
PDF: 14 pages
Proc. SPIE 7122, Photomask Technology 2008, 71220Y (17 October 2008); doi: 10.1117/12.801574
Show Author Affiliations
Andre Poock, AMD, Saxony LLC & Co. KG (Germany)
Sarah McGowan, AMD, Saxony LLC & Co. KG (Germany)
Francois Weisbuch, AMD, Saxony LLC & Co. KG (Germany)
Guido Schnasse, KLA-Tencor Corp. (United States)
Rajesh Ghaskadvi, KLA-Tencor Corp. (United States)

Published in SPIE Proceedings Vol. 7122:
Photomask Technology 2008
Hiroichi Kawahira; Larry S. Zurbrick, Editor(s)

© SPIE. Terms of Use
Back to Top