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Proceedings Paper

An investigation of EUV lithography defectivity
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Paper Abstract

We have used ASML's full field step-and-scan exposure tool for extreme ultraviolet lithography (EUVL), known as an Alpha Demo Tool, to investigate one of the critical issues identified for EUVL, defectivity associated with EUV masks. The main objective for this work was to investigate the infrastructure currently in place to examine defects on a EUV reticle and identify their consequence in exposed resist. Unlike many previous investigations this work looks at naturally occurring defects in a EUV exposed metal layer from a 45 nm node device. The EUV exposure was also integrated into a standard process flow where the other layers were patterned using more conventional 193-nm lithography techniques. This presentation correlates reticle level defectivity to resulting wafer exposures. Defect inspection data from both the 28xx family of KLA-Tencor wafer inspection tool and Terascan reticle inspection tools are presented. Defect populations were characterized with a KLA 5200 Review SEM. Observed defectivity modes were analyzed using both conventional defect inspection methodology as well as advanced techniques in order to gain further insight. We find good correlations between reticle level defects and the resulting wafer exposure defects.

Paper Details

Date Published: 17 October 2008
PDF: 13 pages
Proc. SPIE 7122, Photomask Technology 2008, 71222G (17 October 2008); doi: 10.1117/12.801528
Show Author Affiliations
Kevin D. Cummings, ASML (United States)
Thomas Laursen, ASML (United States)
Bill Pierson, ASML (United States)
Sang-in Han, ASML (United States)
Robert Watso, ASML (United States)
Youri van Dommelen, ASML (United States)
Brian Lee, ASML (United States)
Yunfei Deng, Advanced Micro Devices (United States)
Bruno La Fontaine, Advanced Micro Devices (United States)
Thomas Wallow, Advanced Micro Devices (United States)
Uzo Okoroanyanwu, Advanced Micro Devices (United States)
Obert Wood, Advanced Micro Devices (United States)
Anna Tchikoulaeva, AMD Fab36 LLC (Germany)
Christian Holfeld, Advanced Mask Technology Ctr. (Germany)
Jan Hendrick Peters, Advanced Mask Technology Ctr. (Germany)
Chiew-seng Koay, IBM Corp. (United States)
Karen Petrillo, IBM Corp. (United States)
Tony DiBiase, KLA-Tencor Corp. (United States)
Sumanth Kini, KLA-Tencor Corp. (United States)
Hiroyuki Mizuno, Toshiba America Electronics Components (United States)

Published in SPIE Proceedings Vol. 7122:
Photomask Technology 2008
Hiroichi Kawahira; Larry S. Zurbrick, Editor(s)

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