Share Email Print

Proceedings Paper

Improving contact and via process latitude through selective upsizing
Author(s): C. Yuan; G. Abeln; B. Anthony; G. Chen; S. Robertson; P. Walker
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

This paper describes a simple technique to improve the process latitude for contact and via printing. The technique applies a selective upsizing algorithm to the mask data during the mask preparation step. For each contact or via, the algorithm looks for available spaces by checking relevant layers near it. When spaces are available, selective edges of a contact or via will be sized to improve the process latitude. This paper describes algorithms used to implement this technique. Multiple designs of various design styles are used to demonstrate the effectiveness of the algorithms. The implications on mask preparation, mask making and wafer processing are also discussed.

Paper Details

Date Published: 17 October 2008
PDF: 8 pages
Proc. SPIE 7122, Photomask Technology 2008, 712223 (17 October 2008); doi: 10.1117/12.801187
Show Author Affiliations
C. Yuan, Freescale Semiconductor (United States)
G. Abeln, Freescale Semiconductor (United States)
B. Anthony, Freescale Semiconductor (United States)
G. Chen, Freescale Semiconductor (United States)
S. Robertson, Freescale Semiconductor (United States)
P. Walker, Freescale Semiconductor (United States)

Published in SPIE Proceedings Vol. 7122:
Photomask Technology 2008
Hiroichi Kawahira; Larry S. Zurbrick, Editor(s)

© SPIE. Terms of Use
Back to Top