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Proceedings Paper

Immersion lithography bevel solutions
Author(s): Len Tedeschi; Osamu Tamada; Masakazu Sanada; Shuichi Yasuda; Masaya Asai
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Paper Abstract

The introduction of Immersion lithography, combined with the desire to maximize the number of potential yielding devices per wafer, has brought wafer edge engineering to the forefront for advanced semiconductor manufactures. Bevel cleanliness, the position accuracy of the lithography films, and quality of the EBR cut has become more critical. In this paper, the effectiveness of wafer track based solutions to enable state-of-art bevel schemes is explored. This includes an integrated bevel cleaner and new bevel rinse nozzles. The bevel rinse nozzles are used in the coating process to ensure a precise, clean film edge on or near the bevel. The bevel cleaner is used immediately before the wafer is loaded into the scanner after the coating process. The bevel cleaner shows promise in driving down defectivity levels, specifically printing particles, while not damaging films on the bevel.

Paper Details

Date Published: 16 April 2008
PDF: 8 pages
Proc. SPIE 6922, Metrology, Inspection, and Process Control for Microlithography XXII, 692206 (16 April 2008); doi: 10.1117/12.797082
Show Author Affiliations
Len Tedeschi, SOKUDO Co., Ltd. (Japan)
Osamu Tamada, SOKUDO Co., Ltd. (Japan)
Masakazu Sanada, SOKUDO Co., Ltd. (Japan)
Shuichi Yasuda, SOKUDO Co., Ltd. (Japan)
Masaya Asai, SOKUDO Co., Ltd. (Japan)

Published in SPIE Proceedings Vol. 6922:
Metrology, Inspection, and Process Control for Microlithography XXII
John A. Allgair; Christopher J. Raymond, Editor(s)

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