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Proceedings Paper

Diamond micro-milling for array mastering
Author(s): N. C. R. Holme; T. W. Berg; P. G. Dinesen
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Paper Abstract

We will present recent advances in Kaleido Technology on the ultra-precision diamond-milling process, which is an extremely versatile tool for manufacturing of masters for wafer-based replication technologies. Diamond-milling has the advantage of being able to manufacture lenses with much larger radii of curvatures compared to etching methods. Spherical-, aspherical- and free-form-surfaces have been machined with form accuracies better than 200 nm (PV), arrays up to 50 x 50 mm have been manufactured on wafers, with lens-position accuracies better than 3 μm absolute over the entire wafer.

Paper Details

Date Published: 17 September 2008
PDF: 8 pages
Proc. SPIE 7062, Laser Beam Shaping IX, 70620J (17 September 2008); doi: 10.1117/12.796480
Show Author Affiliations
N. C. R. Holme, Kaleido Technology ApS (Denmark)
T. W. Berg, Kaleido Technology ApS (Denmark)
P. G. Dinesen, Kaleido Technology ApS (Denmark)

Published in SPIE Proceedings Vol. 7062:
Laser Beam Shaping IX
Andrew Forbes; Todd E. Lizotte, Editor(s)

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