Technology changes in detector development and the significant improvement of manufacturing accuracy in combination with the permanent engineering research influences the spaceborne sensor systems, which are focused on Earth observation and remote sensing. Developments in focal plane technology, e.g. the combination of large TDI lines, intelligent synchronisation control, fast readable sensors and new focal plane and telescope concepts are the key developments for new remote sensing instruments. This class of instruments disposes of high spatial and radiometric resolution for the generation of data products for mapping and 3D GIS VR applications. Systemic approaches are essential for the design of complex sensor systems based on dedicated tasks. The system-theoretical description of the instrument inside and a simulated environment is the basic approach for the optimisation process of the optical, mechanical and electrical designs and assembly. Single modules and the entire system have to be calibrated and verified. The traceability of the performance-related parameters from the single sensor up to the flight readiness of the instrument forms the main focus inside such complex systems. In the future it will also be possible to prove the sensor performance on wafer level before assembly. This paper gives an overview about current technologies for performance measurements on sensor, focal plane assembly (FPA) and instrument level without the optical performance of the telescope. The paper proposes also a technology, which can be used for sensor performance measurements on wafer level.

Date Published: 20 August 2008
PDF: 8 pages
Proc. SPIE 7081, Earth Observing Systems XIII, 70810U (20 August 2008); doi: 10.1117/12.792555

Published in SPIE Proceedings Vol. 7081:
Earth Observing Systems XIII
James J. Butler; Jack Xiong, Editor(s)