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Proceedings Paper

Study of final polishing slurry for silicon substrate in ULSI
Author(s): Weiguo Di; Ming Yang; Yuling Liu
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Paper Abstract

Based on the analysis of mechanism of silicon polishing, this paper discusses the influence of the final polishing slurry on polishing quality. The selection of components in the final polishing slurry is discussed. The abrasive of small size is used to reduce the surface roughness. The alkali without sodium ions is selected to reduce metal ions pollution. The relation between adsorption mechanism and the surfactant is analyzed. As a result, the nonsodium final polishing slurry with small particle size, high polishing rate and high quality is realized.

Paper Details

Date Published: 11 March 2008
PDF: 4 pages
Proc. SPIE 6984, Sixth International Conference on Thin Film Physics and Applications, 69842I (11 March 2008); doi: 10.1117/12.792138
Show Author Affiliations
Weiguo Di, Shijiazhuang Railway Institute (China)
Ming Yang, Shijiazhuang Railway Institute (China)
Yuling Liu, Hebei Univ. of Technology (China)

Published in SPIE Proceedings Vol. 6984:
Sixth International Conference on Thin Film Physics and Applications
Wenzhong Shen; Junhao Chu, Editor(s)

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