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Proceedings Paper

Technology development for micromirror arrays with high optical fill factor and stable analogue deflection integrated on CMOS substrates
Author(s): Jan-Uwe Schmidt; Martin Friedrichs; Thor Bakke; Benjamin Voelker; Dirk Rudloff; Hubert Lakner
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Paper Abstract

At Fraunhofer IPMS Dresden micromechanical mirror arrays are developed and fabricated using a high-voltage CMOS process for applications such as lithographic mask writers and adaptive optics. Different approaches for the fabrication of micromechanical mirror arrays with up to 1 million analogue addressable pixels in a MEMS-on-CMOS technology are discussed: sacrificial layer technologies of 1-level actuators made from a single Al-TiAl-Al structural multilayer or 2-level actuators with an additional TiAl hinge layer respectively. Also the fabrication of single crystalline Si micro-mirrors using layer-transfer bonding is discussed.

Paper Details

Date Published: 25 April 2008
PDF: 7 pages
Proc. SPIE 6993, MEMS, MOEMS, and Micromachining III, 69930D (25 April 2008); doi: 10.1117/12.787015
Show Author Affiliations
Jan-Uwe Schmidt, Fraunhofer IPMS (Germany)
Martin Friedrichs, Fraunhofer IPMS (Germany)
Thor Bakke, SINTEF ICT (Norway)
Benjamin Voelker, AEMtec GmbH (Germany)
Dirk Rudloff, Fraunhofer IPMS (Germany)
Hubert Lakner, Fraunhofer IPMS (Germany)

Published in SPIE Proceedings Vol. 6993:
MEMS, MOEMS, and Micromachining III
Hakan Urey, Editor(s)

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