Proceedings Paper
Topography of micromirror for metal MEMS optical switch based on fractal theory| Format | Member Price | Non-Member Price |
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Paper Abstract
In this paper, the topographies of various micro-mirror surfaces are measured by Scanning Tunneling Microscope (STM) based on NiCrAu MEMS optical switch unit which is desined and fabricated by the authors. Fractal theory and Weierstrass-Mandelbrot function is applied to analyze and simulate the topography of different surfaces. The result shows that the surface of MEMS micromirror which is fabricated by metal sputter has low anisotropism and the W-M function is very efficient in creating models and is very useful for analyzing the topography of MEMS surface.
Paper Details
Date Published: 19 November 2007
PDF: 6 pages
Proc. SPIE 6724, 3rd International Symposium on Advanced Optical Manufacturing and Testing Technologies: Design, Manufacturing, and Testing of Micro- and Nano-Optical Devices and Systems, 67240X (19 November 2007); doi: 10.1117/12.782722
Published in SPIE Proceedings Vol. 6724:
3rd International Symposium on Advanced Optical Manufacturing and Testing Technologies: Design, Manufacturing, and Testing of Micro- and Nano-Optical Devices and Systems
Sen Han; Tingwen Xing; Yanqiu Li; Zheng Cui, Editor(s)
PDF: 6 pages
Proc. SPIE 6724, 3rd International Symposium on Advanced Optical Manufacturing and Testing Technologies: Design, Manufacturing, and Testing of Micro- and Nano-Optical Devices and Systems, 67240X (19 November 2007); doi: 10.1117/12.782722
Show Author Affiliations
Yi Zhang, Chongqing Univ. of Posts and Telecommunications (China)
Yuan Luo, Chongqing Univ. of Posts and Telecommunications (China)
Yuan Luo, Chongqing Univ. of Posts and Telecommunications (China)
Xiaodong Xu, Chongqing Univ. of Posts and Telecommunications (China)
Published in SPIE Proceedings Vol. 6724:
3rd International Symposium on Advanced Optical Manufacturing and Testing Technologies: Design, Manufacturing, and Testing of Micro- and Nano-Optical Devices and Systems
Sen Han; Tingwen Xing; Yanqiu Li; Zheng Cui, Editor(s)
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