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Proceedings Paper

Micromachined multicavity grey body emitter for the use in MIR spectroscopic systems
Author(s): J. Hildenbrand; A. Kürzinger; E. Moretton; A. Greiner; A. Lambrecht; J. Wöllenstein; J. G. Korvink
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Paper Abstract

A grey body emitter based on a microcavity array with Pt-heater on the backside is presented. The microcavity array is made by electro-chemical etching of silicon. It has been shown in a previous work, that this emitter has especially in the spectral region >8 μm significantly higher emissivity than commercial available emitters. Due to the thin-film technology of MEMS-based emitters, these types can be typically operated with a maximum temperature of 700°C to 800°C. Higher temperature causes degradation of the heater. But higher temperatures also mean an enhancement in radiation power and thus open a wider area of application. The presented work shows a temperature enhanced thermal emitter with a ceramic heater passivation. Short time tests show the possibility of a maximum temperature of 1000°C. The part of light emitted by the microcavities in comparison to the whole device as well as the influence of the pore size concerning the emitted spectral range is investigated. The results are the basis for a redesign of the microcavity array for an enhancement of the geometry tuned emissivity.

Paper Details

Date Published: 24 April 2008
PDF: 9 pages
Proc. SPIE 6993, MEMS, MOEMS, and Micromachining III, 699304 (24 April 2008); doi: 10.1117/12.780859
Show Author Affiliations
J. Hildenbrand, Fraunhofer-Institute for Physical Measurement Technique (Germany)
A. Kürzinger, Fraunhofer-Institute for Physical Measurement Technique (Germany)
E. Moretton, Fraunhofer-Institute for Physical Measurement Technique (Germany)
A. Greiner, Univ. of Freiburg (Germany)
A. Lambrecht, Fraunhofer-Institute for Physical Measurement Technique (Germany)
J. Wöllenstein, Fraunhofer-Institute for Physical Measurement Technique (Germany)
J. G. Korvink, Univ. of Freiburg (Germany)

Published in SPIE Proceedings Vol. 6993:
MEMS, MOEMS, and Micromachining III
Hakan Urey, Editor(s)

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